The OPRECOMP consortium is built upon an interdisciplinary team of experts in Mathematics, Algorithms, Applications, Software Engineering, System Design, Integration , Circuits, Architecture, Physics, and Memory Technology from 8 European and 2 Swiss universities, research institutions and companies.
IBM Research GmbH, Zürich, Switzerland
ETH Zürich, Switzerland
CEA, Paris, France
UNIPG, Perugia, Italy
UNIBO, Bologna, Italy
CINECA, Bologna, Italy
UJI, Castellon, Spain
QUB, Belfast, UK
GreenWaves Technologies, Grenoble, France
TUKL, Kaiserslautern, Germany
Partners Leading Roles
Project Coordinator: IBM
Applications
Lead by IBM, Main contributions from CINECA and GreenWaves
Key Points: Big Data Analytics, Deep Learning, HPC application, as well as IoT.
Architecture & Circuits
Lead by ETHZ, Main contributions from GreenWaves, IBM, CEA
Key Points: Develop a Precision-tunable architecture: processors, memory hierarchy and Network-on-chip are designed to that they can be dynamically configured to offer a wide range of levels in precision and robustness, trading them off with energy efficiency. Also focus on HPC-Power9, Compilers, Dynamic compilation, etc. Circuit implementation in the milliWatt range (Pulp), Sensors and actuators for tracking operating conditions, reducing operating margins and linking the operating point to the level of precision required.
Physical Foundations
Lead by UNIPG
Key Points: Demonstrate that transprecision computing is the way to think about future systems. Link between energy-efficiency and transprecision. Role of modeling. Theoretical limit of computation.
Algorithms
Lead by UJI, Main contributions from IBM
Key Points: Linear algebra, iterative schemes, data structure and management, everything needed by the applications.
Mathematical Theory
Lead by UJI, Main contributions from UNIPG
SW/System Design/Integration
Lead by QUB, Main contributions from UNIBO & CEA
Key Points: Show a solid vertical integration in the final system. Interconnect, allocation, scheduling, extension to OpenMP/MPI, etc.. This is mostly software oriented.
Dissemination & Innovation
Lead by GreenWaves, Main contributions from CINECA, IBM, ETHZ
Key Points: Show a solid vertical integration in the final system. Interconnect, allocation, scheduling, extension to OpenMP/MPI, etc.. This is mostly software oriented.
Technology
Lead by TUKL, Main contributions from CEA & UNIPG
Key Points: 3D-main memories, monolithically integrated devices, new NV memories, ultra-fast interconnect (e.g. Optical?), disruptive technology, fabrication technologies.